LENJEX Solution Center
Removes flux, rosin and ionic residues from soldered circuit boards with controlled frequency and compatible chemistry.
Overview
Flux residues affect reliability.
After soldering, flux and rosin can leave visible films and ionic residues that cause corrosion, leakage and poor coating adhesion. Ultrasonic cleaning reaches under components and between leads to remove these residues consistently.
A compatible de-flux cleaning solution and controlled energy protect the assembly, followed by complete drying. See electronics and PCB cleaning.
Process Considerations
Chemistry and component compatibility first.
Rosin, no-clean and water-soluble fluxes leave different residues.
De-flux chemistry or compatible solvent is selected for the flux and board.
Frequency, energy and exposure are controlled to protect sensitive components.
Complete drying removes moisture under components before coating.
Recommended Route
Validated with the actual board.
Related Systems
Benchtop to compact systems.
Benchtop Cleaners
A 2-45 L professional benchtop range with digital time, temperature and power control for laboratory, workshop and small-batch use.
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Benchtop & Laboratory Ultrasonic Cleaners
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Industrial Single-Tank & Special Cleaners
Sealed vacuum ultrasonic cleaning and drying with hydrocarbon or modified-alcohol solvent
View configurationSolution Questions
Yes. Controlled cavitation with de-flux chemistry removes rosin and ionic residues under components, followed by complete drying.
Water-based de-flux is common; solvent or vacuum systems are used where water is unsuitable or drying is difficult.
Energy and frequency are controlled and compatibility is validated with the actual board before production.
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