LENJEX Industrial Cleaning
Ultrasonic cleaning removes flux, rosin and ionic residues from printed circuit boards and electronic assemblies, with controlled frequency and compatible chemistry.
Why Ultrasonic
After soldering, circuit boards can carry flux, rosin, ionic residues and particulates that affect reliability and conformal coating. Ultrasonic cleaning reaches under components and between leads to remove these residues consistently.
Because electronics can be sensitive, frequency and energy are controlled, with a compatible de-flux cleaning solution. The digital benchtop cleaner, laboratory cleaner and, for non-aqueous work, vacuum solvent cleaner are commonly reviewed. See the flux and rosin removal solution.
Compatibility with the specific board, components and any sensitive parts must be confirmed before production cleaning.
Typical Workpieces
Contamination
Cleanliness Target
Acceptance is based on visible residue, ionic cleanliness or surface-inspection results, depending on the product and coating requirements.
Drying must be complete to avoid trapped moisture under components.
Recommended Sequence
The final sequence depends on soil loading, material, rinse quality and drying behavior.
Recommended Equipment
The final specification follows process testing and production analysis.
Benchtop Cleaners
A 2-45 L professional benchtop range with digital time, temperature and power control for laboratory, workshop and small-batch use.
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Benchtop & Laboratory Ultrasonic Cleaners
Scientific lab ultrasonic bath with degas, sweep and precise control
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Industrial Single-Tank & Special Cleaners
Sealed vacuum ultrasonic cleaning and drying with hydrocarbon or modified-alcohol solvent
View configurationProcess Controls
Confirm the part, soil, loading and final handling before fixing equipment settings.
Control 01
Record surfaces, cavities and features that can trap air or liquid.
Control 02
Test the heaviest representative contamination, not an ideal sample.
Control 03
Keep acoustic access and part spacing consistent with production.
Control 04
Match downstream handling to residue and corrosion risks.
System Selection
Stage count and automation follow the validated process and required output.
Batch
Compare for focused washing where rinsing and drying are managed separately.
Multi-stage
Add controlled stages when carryover and final condition matter.
Automatic
Evaluate automation when output, handling or recipe control requires it.
Acceptance
Use the same practical inspection method for trial samples and production parts.
Representative Trial
Trial evidence should cover normal production and the most difficult expected condition.
Application Questions
Include normal production parts and the most difficult expected geometry or contamination so the process is not based on an easy sample.
Provide part dimensions, material, soil, cleanliness target, parts per load, required output and available utilities.
It can affect sensitive components if frequency, energy and chemistry are not controlled. LENJEX confirms compatibility with the actual board and component set before production cleaning.
Both are used: water-based de-flux chemistry is common, while solvent or vacuum solvent systems are chosen where water is unsuitable or drying is difficult.
Yes. Complete drying, including under components, is required to avoid moisture-related defects and to prepare the board for conformal coating.
Related Applications
Industrial Application
Gentle, controlled cleaning of semiconductor parts, carriers and tooling, where fine particles and surface integrity are critical.
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Industrial Application
Precision cleaning is controlled by particle size, surface sensitivity, rinse quality, bath condition and handling after the wash.
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Industrial Application
Gentle ultrasonic cleaning removes polishing compound, particles and fingerprints from optical components without scratching coated surfaces.
View cleaning approach